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Leaner, Meaner Chip Card Package Infineon Technologies AG and Giesecke Devrient GmbH (GD) have jointly developed an innovative production method for chip packages specifically for use in chip card applications. The FCOS (Flip Chip On Substrate) method unveiled today is the first in which a chip card IC is rotated or flipped inside the module housing it. The functional side of the chip is attached directly to the module by means of conductive contacts; conventional gold wires and synthetic resin encapsulation are no longer required. The new attachment technique saves space in the module; additionally, it is even more robust than the conventional wiring solution. This means that the whole module handles high mechanical stresses better like those encountered, for example, when a chip card is sent by post and passes through the postal system`s sorting machines.
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