News
SUSS Introduces New LED Wafer-Level Bonding Technology Reduces Cost, Increases Throughput up to 8X
MUNICH, Germany September 26th, 2005 - SUSS MicroTec, AG introduces their new patent pending technology that performs simultaneous bonding of wafers, including eutectic processes to achieve impressive cost reduction while increasing throughput up to 8X. SUSS' new high throughput LED bonder has been accepted worldwide for applications including bonding of HIGH POWER and HIGH BRIGHTNESS LEDs.
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