News
SUSS MicroTec Announces IBM Order for High Volume C4NP Bumping Line MUNICH, Germany September 8th, 2005 - SUSS MicroTec AG (Prime Standard) announced that IBM has ordered the first C4NP (Controlled Collapse Chip Connection - New Process) high-volume bumping line from SUSS.
The IBM order is for a fully automatic bumping line that can accommodate up to 300 wafer starts per day. Shipment is scheduled for the end of the first quarter of 2006. IBM plans to use the line for the needs of their existing and future electronic products.
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