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IBM and Toppan to Jointly Develop Advanced Photomasks for 45nm

Goal Is Early Establishment of 45nm Photomask Production ProcessIBM Corporation and Toppan Printing Co., Ltd. today announced an agreement to jointly develop photomasks for next generation, 45-nanometer semiconductor manufacturing processes. The two companies will develop a photomask process intended to enable early production of 45nm devices. Approximately US$200 million is expected to be invested by the two companies.