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TSMC Qualifies Applied Materials' Gate Stack System for Its Leading-Edge 65nm Transistor Processes

Applied Materials, Inc. announced today that Taiwan Semiconductor Manufacturing Co. (TSMC) has qualified the Applied Centura Gate Stack system with DPN (decoupled plasma nitridation) technology for all of its 65nm-generation transistor fabrication processes. This advanced technology enabled TSMC to achieve their 65nm equivalent oxide thickness (EOT) scaling targets while increasing device speed.